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Chipbond Technology (ROCO:6147) Interest Paid


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What is Chipbond Technology Interest Paid?

Interest Paid only applicable to companies reporting Cash Flow from Operations in direct method.


Chipbond Technology (ROCO:6147) Business Description

Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300
Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services.