Chipbond Technology (ROCO:6147) Marketable Securities : NT$5 Mil (As of Mar. 2025)

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What is Chipbond Technology Marketable Securities?

Marketable Securities are very liquid securities that can be converted into cash quickly at a reasonable price. Chipbond Technology's Marketable Securities for the quarter that ended in Mar. 2025 was NT$5 Mil.

Chipbond Technology's annual Marketable Securities increased from Dec. 2022 (NT$2 Mil) to Dec. 2023 (NT$6 Mil) but then declined from Dec. 2023 (NT$6 Mil) to Dec. 2024 (NT$5 Mil).

Chipbond Technology Marketable Securities Historical Data

The historical data trend for Chipbond Technology's Marketable Securities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Chipbond Technology Marketable Securities Chart

Chipbond Technology Annual Data

Trend

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Dec24

Marketable Securities

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59.81

2.01

6.22

5.00

Chipbond Technology Quarterly Data
	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24	Jun24	Sep24	Dec24	Mar25
Marketable Securities	Get a 7-Day Free Trial															1,401.17	-	1,230.68	5.00	5.01

Chipbond Technology Marketable Securities Calculation

Marketable Securities are very liquid securities that can be converted into cash quickly at a reasonable price.

Chipbond Technology (ROCO:6147) Marketable Securities Explanation

Marketable Securities are very liquid as they tend to have maturities of less than one year. Furthermore, the rate at which these securities can be bought or sold has little effect on their prices.

Please note, GuruFocus' Marketable Securities also includes "Other Short Term Investment".

Chipbond Technology Marketable Securities Related Terms

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Chipbond Technology Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Chipbond Technology Corp (ROCO:6147) » Definitions » Marketable Securities

Comparable Companies

Traded in Other Exchanges

N/A

Address

No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300094

Website

https://www.chipbond.com.tw

Chipbond Technology Corp is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services. The products and services offered by the company include, Chip Tray, SiGe Wafer, SiC Wafer, Gold Bumping services, Packaging attachment services among others.

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