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Chipbond Technology (ROCO:6147) Minority Interest : NT$0.00 Mil (As of Mar. 2025)


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What is Chipbond Technology Minority Interest?

Minority interest is the carrying amount of the equity interests owned by non-controlling shareholders, partners, or other equity holders in one or more of the entities included in the reporting entity's consolidated financial statements.

Chipbond Technology's minority interest for the quarter that ended in Mar. 2025 was NT$0.00 Mil.

Chipbond Technology Minority Interest Historical Data

The historical data trend for Chipbond Technology's Minority Interest can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Chipbond Technology Minority Interest Chart

Chipbond Technology Annual Data
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Chipbond Technology Quarterly Data
Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24 Mar25
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Chipbond Technology Minority Interest Calculation

Minority interest is the carrying amount of the equity interests owned by non-controlling shareholders, partners, or other equity holders in one or more of the entities included in the reporting entity's consolidated financial statements.

Chipbond Technology Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Chipbond Technology Corp (ROCO:6147) » Definitions » Minority Interest
Comparable Companies
TPE:3035 TPE:6257 TPE:3189 TPE:2441 TPE:3532 TPE:3413 TPE:3450 ROCO:6223 ROCO:3131 ROCO:6510 XAMS:ASML AMAT KLAC LRCX TSE:8035 SZSE:002371 TSE:6857 XAMS:ASM TSE:6146 SHSE:688012
Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300094
Website
https://www.chipbond.com.tw
Chipbond Technology Corp is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services. The products and services offered by the company include, Chip Tray, SiGe Wafer, SiC Wafer, Gold Bumping services, Packaging attachment services among others.

Chipbond Technology Headlines

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