Chipbond Technology (ROCO:6147) Total Liabilities: NT$8,604 Mil (As of Mar. 2026)

Author: Vera Yuan Vera Yuan
Vera Yuan
Vera Yuan
Director of Data and Quant Analytics at GuruFocus
Focused on building reliable datasets, financial models, and research tools for value-minded investors. Committed to turning complex data into practical guidance for value-investing and long-term wealth.
Reviewed by: Charlie Tian Charlie Tian
Charlie Tian
Charlie Tian
Founder & CEO of GuruFocus
Dr. Charlie Tian is the founder and CEO of GuruFocus.com, a leading global investment research platform established in 2004. With a Ph.D. in physics, Dr. Tian transitioned from science to finance, applying a data-driven, disciplined approach to value investing.

ROCO:6147 Chipbond Technology Corp ROCO:6147
65 GF Score
Price NT$186.00
GF Value NT$74.87
Valuation Significantly Overvalued
! 5 Warning Signs
View Full Analysis

What is Chipbond Technology Total Liabilities?

Chipbond Technology ROCO:6147 -6.06% 65 Total Liabilities is NT$8,604 Mil as of Mar. 2026. GuruFocus rates ROCO:6147 with a GF Score™ of 65/100 and a GF Value™ of NT$74.87 (Significantly Overvalued). The stock has 5 warning signs investors should review.

Chipbond Technology's Total Liabilities for the quarter that ended in Mar. 2026 was NT$8,604 Mil.

Chipbond Technology's quarterly Total Liabilities increased from Sep. 2025 (NT$5,784.01 Mil) to Dec. 2025 (NT$6,861.84 Mil) and increased from Dec. 2025 (NT$6,861.84 Mil) to Mar. 2026 (NT$8,604.38 Mil).

Chipbond Technology's annual Total Liabilities declined from Dec. 2023 (NT$6,046.37 Mil) to Dec. 2024 (NT$4,889.95 Mil) but then increased from Dec. 2024 (NT$4,889.95 Mil) to Dec. 2025 (NT$6,861.84 Mil).

Chipbond Technology Total Liabilities Historical Data

* Premium members only.

The historical data trend for Chipbond Technology's Total Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

Chipbond Technology Total Liabilities Chart

Chipbond Technology Annual Data
Trend Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24 Dec25
Total Liabilities
Get a 7-Day Free Trial Premium Member Only Premium Member Only 12,124.54 10,066.42 6,046.37 4,889.95 6,861.84

Chipbond Technology Quarterly Data
Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24 Mar25 Jun25 Sep25 Dec25 Mar26
Total Liabilities Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 7,508.74 7,455.98 5,784.01 6,861.84 8,604.38
ROCO:6147
65GF Score
Chipbond Technology Corp ROCO:6147
Total Liabilities is just one metric. See GF Score™, valuation, warning signs, and more.
View Full Analysis

Chipbond Technology Total Liabilities Calculation

Total Liabilities are the liabilities that the company has to pay others. It is a part of the balance sheet of a company that shareholders do not own, and would be obligated to pay back if the company liquidated.

Chipbond Technology's Total Liabilities for the fiscal year that ended in Dec. 2025 is calculated as

Total Liabilities=Total Current Liabilities+Total Noncurrent Liabilities
=Total Current Liabilities+(Long-Term Debt & Capital Lease Obligation+Other Long-Term Liabilities
=4349.85+(1608.71+903.283
+NonCurrent Deferred Liabilities+PensionAndRetirementBenefit+NonCurrent Deferred Income Tax)
+0+0+0)
=6,862

Total Liabilities=Total Assets (A: Dec. 2025 )-Total Equity (A: Dec. 2025 )
=54230.273-47368.43
=6,862

Chipbond Technology's Total Liabilities for the quarter that ended in Mar. 2026 is calculated as

Total Liabilities=Total Current Liabilities+Total Noncurrent Liabilities
=Total Current Liabilities+(Long-Term Debt & Capital Lease Obligation+Other Long-Term Liabilities
=6098.495+(1627.551+878.335
+NonCurrent Deferred Liabilities+PensionAndRetirementBenefit+NonCurrent Deferred Income Tax)
+0+0+0)
=8,604

Total Liabilities=Total Assets (Q: Mar. 2026 )-Total Equity (Q: Mar. 2026 )
=55485.85-46881.469
=8,604

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

Frequently Asked Questions Learn more about Total Liabilities →
What does a Total Liabilities of NT$8,604 Mil mean?
Chipbond Technology (ROCO:6147) has a Total Liabilities of NT$8,604 Mil as of Mar. 2026. The total amount of liabilities as recorded on a company's balance sheet. View historical data for Chipbond Technology and its competitors.
Is Chipbond Technology's Total Liabilities too high?
Chipbond Technology's current Total Liabilities is NT$8,604 Mil. Overall, Chipbond Technology has a GF Score™ of 65/100 and is considered Significantly Overvalued, reflecting its overall financial health beyond just this single metric.
How does Chipbond Technology's Total Liabilities compare to AMAT and LRCX?
Chipbond Technology's Total Liabilities of NT$8,604 Mil can be compared against companies in the Semiconductors industry. See the competitive comparison table and distribution chart on this page for a detailed peer-by-peer breakdown.
What is a good Total Liabilities for a Semiconductors company?
A good Total Liabilities depends on the Semiconductors industry context. However, Total Liabilities should not be evaluated in isolation — investors should consider it alongside profitability, growth, and financial strength metrics. Use the industry distribution chart on this page to see where any company falls relative to its peers.
What does a high Total Liabilities mean?
A high Total Liabilities can signal that a stock is expensive relative to its fundamentals. The total amount of liabilities as recorded on a company's balance sheet. View historical data for Chipbond Technology and its competitors. Chipbond Technology's current Total Liabilities is NT$8,604 Mil. However, context matters — high-growth companies often justify higher valuations. Always evaluate alongside other metrics like GF Score™ and GF Value™.
Is Chipbond Technology stock overvalued right now?
Based on GuruFocus' analysis, Chipbond Technology (ROCO:6147) is currently considered Significantly Overvalued. The stock's GF Value™ is NT$74.87, compared to a current price of NT$186.00 — trading 148.4% above its estimated fair value. The current Total Liabilities is NT$8,604 Mil. Chipbond Technology's overall GF Score™ is 65/100 with 5 warning signs to review. Investors should evaluate multiple metrics — including profitability, growth, and financial strength — before making a decision.
How is Total Liabilities calculated?
Total Liabilities is calculated from a company's financial statements. For Chipbond Technology (ROCO:6147), the current Total Liabilities is NT$8,604 Mil as of Mar. 2026. GuruFocus calculates this using data sourced from SEC filings and annual reports. See the calculation section and 30-year financial data on this page for the full breakdown.

Is Chipbond Technology (ROCO:6147) Overvalued in 2026?

Based on GuruFocus' analysis, Chipbond Technology stock appears to be overvalued. The current stock price of NT$186.00 is trading 148.4% above its estimated GF Value™ of NT$74.87. GuruFocus considers Chipbond Technology to be Significantly Overvalued.

Key valuation signals for ROCO:6147:

  • Total Liabilities: NT$8,604 Mil
  • GF Value™: NT$74.87 vs. price of NT$186.00 (148.4% above fair value)
  • GF Score™: 65/100 with 5 warning signs

No single metric tells the full story. See the ROCO:6147 stock analysis page for a complete view including 30-year financials, guru trades, and insider activity.

Chipbond Technology Business Description

Address No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300094
Chipbond Technology Corp is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services. The products and services offered by the company include Chip Tray, SiGe Wafer, SiC Wafer, Gold Bumping services, and Packaging attachment services among others.
65GF Score

Get the complete analysis for ROCO:6147

Total Liabilities is just one metric. See GF Value™, 30-year financials, guru trades, warning signs, and more.

NT$186.00
Price
NT$74.87
GF Value