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Chipbond Technology (ROCO:6147) EBITDA Margin % : 35.34% (As of Sep. 2024)


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What is Chipbond Technology EBITDA Margin %?

EBITDA Margin % is calculated as EBITDA divided by its Revenue. Chipbond Technology's EBITDA for the three months ended in Sep. 2024 was NT$1,961 Mil. Chipbond Technology's Revenue for the three months ended in Sep. 2024 was NT$5,549 Mil. Therefore, Chipbond Technology's EBITDA margin for the quarter that ended in Sep. 2024 was 35.34%.


Chipbond Technology EBITDA Margin % Historical Data

The historical data trend for Chipbond Technology's EBITDA Margin % can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Chipbond Technology EBITDA Margin % Chart

Chipbond Technology Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
EBITDA Margin %
Get a 7-Day Free Trial Premium Member Only Premium Member Only 41.22 35.39 40.73 47.65 43.31

Chipbond Technology Quarterly Data
Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24
EBITDA Margin % Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 45.95 38.18 51.73 40.26 35.34

Competitive Comparison of Chipbond Technology's EBITDA Margin %

For the Semiconductor Equipment & Materials subindustry, Chipbond Technology's EBITDA Margin %, along with its competitors' market caps and EBITDA Margin % data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Chipbond Technology's EBITDA Margin % Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Chipbond Technology's EBITDA Margin % distribution charts can be found below:

* The bar in red indicates where Chipbond Technology's EBITDA Margin % falls into.



Chipbond Technology EBITDA Margin % Calculation

EBITDA margin is the ratio of EBITDA divided by net sales or Revenue, usually presented in percent.

Chipbond Technology's EBITDA Margin % for the fiscal year that ended in Dec. 2023 is calculated as

EBITDA Margin %=EBITDA (A: Dec. 2023 )/Revenue (A: Dec. 2023 )
=8686.955/20056.388
=43.31 %

Chipbond Technology's EBITDA Margin % for the quarter that ended in Sep. 2024 is calculated as

EBITDA Margin %=EBITDA (Q: Sep. 2024 )/Revenue (Q: Sep. 2024 )
=1960.991/5548.995
=35.34 %

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Chipbond Technology  (ROCO:6147) EBITDA Margin % Explanation

EBITDA Margin % is the ratio of EBITDA divided by net sales or Revenue. It is an performance metric measuring company's operating profitability. EBITDA Margin takes depreciation and amortization, interest expense and tax into account, which makes it easy to compare the relative profitability of companies of different sizes in the same industry.


Chipbond Technology EBITDA Margin % Related Terms

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Chipbond Technology Business Description

Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300094
Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services. The products and services offered by the company include, Chip Tray, SiGe Wafer, SiC Wafer, Gold Bumping services, Packaging attachment services among others.

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