Chipbond Technology (ROCO:6147) Change In Payables And Accrued Expense : NT$0 Mil (TTM As of Mar. 2025)

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What is Chipbond Technology Change In Payables And Accrued Expense?

Chipbond Technology's Change In Payables And Accrued Expense for the quarter that ended in Mar. 2025 was NT$0 Mil. It means Chipbond Technology's Accounts Payable & Accrued Expense stayed the same from Dec. 2024 to Mar. 2025 .

Chipbond Technology's Change In Payables And Accrued Expense for the fiscal year that ended in Dec. 2024 was NT$0 Mil. It means Chipbond Technology's Accounts Payable & Accrued Expense stayed the same from Dec. 2023 to Dec. 2024 .

Chipbond Technology Change In Payables And Accrued Expense Historical Data

The historical data trend for Chipbond Technology's Change In Payables And Accrued Expense can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Chipbond Technology Change In Payables And Accrued Expense Chart

Chipbond Technology Annual Data

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Change In Payables And Accrued Expense

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Chipbond Technology Quarterly Data
	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24	Jun24	Sep24	Dec24	Mar25
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Chipbond Technology Change In Payables And Accrued Expense Calculation

Change In Payables And Accrued Expense is the increase or decrease between periods of the Accounts Payable & Accrued Expense. Accrued expenses represent expenses incurred at the end of the reporting period but not yet paid; also called accrued liabilities. The accrued liability is shown under Liabilities section in the balance sheet.

Change In Payables And Accrued Expense for the trailing twelve months (TTM) ended in Mar. 2025 adds up the quarterly data reported by the company within the most recent 12 months, which was NT$0 Mil.

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Chipbond Technology Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Chipbond Technology Corp (ROCO:6147) » Definitions » Change In Payables And Accrued Expense

Comparable Companies

Traded in Other Exchanges

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Address

No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300094

Website

https://www.chipbond.com.tw

Chipbond Technology Corp is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services. The products and services offered by the company include, Chip Tray, SiGe Wafer, SiC Wafer, Gold Bumping services, Packaging attachment services among others.

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