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Chipbond Technology (ROCO:6147) Current Accrued Expense : NT$0 Mil (As of Mar. 2025)


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What is Chipbond Technology Current Accrued Expense?

Chipbond Technology's Current Accrued Expense for the quarter that ended in Mar. 2025 was NT$0 Mil.


Chipbond Technology Current Accrued Expense Historical Data

The historical data trend for Chipbond Technology's Current Accrued Expense can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Chipbond Technology Current Accrued Expense Chart

Chipbond Technology Annual Data
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Current Accrued Expense
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Chipbond Technology Quarterly Data
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Chipbond Technology Current Accrued Expense Calculation

Current Accrued Expense is the expense incurred during the accounting period, but not required to be paid until a later date. It includes compensation, interest, pensions and all other miscellaneous accruals reported by the company.


Chipbond Technology Current Accrued Expense Related Terms

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Chipbond Technology Business Description

Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300094
Chipbond Technology Corp is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services. The products and services offered by the company include, Chip Tray, SiGe Wafer, SiC Wafer, Gold Bumping services, Packaging attachment services among others.

Chipbond Technology Headlines

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