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Chipbond Technology (ROCO:6147) Cash Payments for Deposits by Banks and Customers


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What is Chipbond Technology Cash Payments for Deposits by Banks and Customers?

Cash Payments for Deposits by Banks and Customers only applicable to companies reporting Cash Flow from Operations in direct method.


Chipbond Technology Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Chipbond Technology Corp (ROCO:6147) » Definitions » Cash Payments for Deposits by Banks and Customers
Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300094
Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services. The products and services offered by the company include, Chip Tray, SiGe Wafer, SiC Wafer, Gold Bumping services, Packaging attachment services among others.