GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Chipbond Technology Corp (ROCO:6147) » Definitions » Change In Other Working Capital

Chipbond Technology (ROCO:6147) Change In Other Working Capital : NT$72 Mil (TTM As of Jun. 2024)


View and export this data going back to 2002. Start your Free Trial

What is Chipbond Technology Change In Other Working Capital?

Chipbond Technology's Change In Other Working Capital for the quarter that ended in Jun. 2024 was NT$1,302 Mil. It means Chipbond Technology's Other Working Capital increased by NT$1,302 Mil from Mar. 2024 to Jun. 2024 .

Chipbond Technology's Change In Other Working Capital for the fiscal year that ended in Dec. 2023 was NT$-647 Mil. It means Chipbond Technology's Other Working Capital declined by NT$647 Mil from Dec. 2022 to Dec. 2023 .


Chipbond Technology Change In Other Working Capital Historical Data

The historical data trend for Chipbond Technology's Change In Other Working Capital can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Chipbond Technology Change In Other Working Capital Chart

Chipbond Technology Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Change In Other Working Capital
Get a 7-Day Free Trial Premium Member Only Premium Member Only 84.10 244.12 180.33 70.48 -646.56

Chipbond Technology Quarterly Data
Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24
Change In Other Working Capital Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 877.41 109.17 157.81 -1,497.18 1,302.12

Chipbond Technology Change In Other Working Capital Calculation

Change In Other Working Capital is any increase or decrease between periods of other working capital that are not otherwise classified.

Change In Other Working Capital for the trailing twelve months (TTM) ended in Jun. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was NT$72 Mil.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Chipbond Technology Change In Other Working Capital Related Terms

Thank you for viewing the detailed overview of Chipbond Technology's Change In Other Working Capital provided by GuruFocus.com. Please click on the following links to see related term pages.


Chipbond Technology Business Description

Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300
Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services.

Chipbond Technology Headlines

No Headlines