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Chipbond Technology (ROCO:6147) Issuance of Debt : NT$400 Mil (TTM As of Jun. 2024)


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What is Chipbond Technology Issuance of Debt?

Chipbond Technology's Issuance of Debt for the three months ended in Jun. 2024 was NT$0 Mil.

Chipbond Technology's Issuance of Debt for the trailing twelve months (TTM) ended in Jun. 2024 was NT$400 Mil.


Chipbond Technology Issuance of Debt Historical Data

The historical data trend for Chipbond Technology's Issuance of Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Chipbond Technology Issuance of Debt Chart

Chipbond Technology Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Issuance of Debt
Get a 7-Day Free Trial Premium Member Only Premium Member Only 2,900.00 7,600.00 14,840.00 7,000.00 2,600.00

Chipbond Technology Quarterly Data
Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24
Issuance of Debt Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 800.00 900.00 -500.00 - -

Chipbond Technology Issuance of Debt Calculation

Issuance of Debt represents all the cash inflow from debt, including both long-term debt and short-term debt.

Issuance of Debt for the trailing twelve months (TTM) ended in Jun. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was NT$400 Mil.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Chipbond Technology Issuance of Debt Related Terms

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Chipbond Technology Business Description

Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300
Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services.

Chipbond Technology Headlines

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