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Chipbond Technology (ROCO:6147) Future 3-5Y EPS without NRI Growth Rate : 8.17 (As of Sep. 24, 2024)


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What is Chipbond Technology Future 3-5Y EPS without NRI Growth Rate?

Future 3-5Y EPS without NRI Growth Rate is the average growth rate of earnings per share (EPS) estimates over a 3-year to 5-year period.

As of today, Chipbond Technology's Future 3-5Y EPS without NRI Growth Rate is 8.17.


Competitive Comparison of Chipbond Technology's Future 3-5Y EPS without NRI Growth Rate

For the Semiconductor Equipment & Materials subindustry, Chipbond Technology's Future 3-5Y EPS without NRI Growth Rate, along with its competitors' market caps and Future 3-5Y EPS without NRI Growth Rate data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Chipbond Technology's Future 3-5Y EPS without NRI Growth Rate Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Chipbond Technology's Future 3-5Y EPS without NRI Growth Rate distribution charts can be found below:

* The bar in red indicates where Chipbond Technology's Future 3-5Y EPS without NRI Growth Rate falls into.



Chipbond Technology  (ROCO:6147) Future 3-5Y EPS without NRI Growth Rate Explanation

Future 3-5Y EPS without NRI Growth Rate s the average growth rate of earnings per share (EPS) estimates over a 3-year to 5-year period.

Please click Growth Rate Calculation Example (GuruFocus) to see how GuruFocus calculates Wal-Mart Stores Inc (WMT)'s revenue growth rate. You can apply the same method to get the average earnings per share (EPS) estimates growth rate.


Chipbond Technology Future 3-5Y EPS without NRI Growth Rate Related Terms

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Chipbond Technology Business Description

Industry
Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300
Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services.

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