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Chipbond Technology (ROCO:6147) 6-Month Price Index : 0.86 (As of Sep. 24, 2024)


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What is Chipbond Technology 6-Month Price Index?

6-Month Price Index is an intermediate-term momentum that shows the price change relative to 6-month ago. It’s calculated by current share price divided by share price 6-months ago. As of today (2024-09-24), Chipbond Technology's 6-Month Price Index is 0.86.


Competitive Comparison of Chipbond Technology's 6-Month Price Index

For the Semiconductor Equipment & Materials subindustry, Chipbond Technology's 6-Month Price Index, along with its competitors' market caps and 6-Month Price Index data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Chipbond Technology  (ROCO:6147) 6-Month Price Index Calculation

6-Month Price Index is calculated as following:

6-Month Price Index=Current Share Price / Share Price 6-Months Ago

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Chipbond Technology  (ROCO:6147) 6-Month Price Index Explanation

Price Index (PI) also called momentum. Strategies involving Price Index are also known as momentum strategies as they allow investors to profit from a company’s stock price. 6-Month Price Index is an intermediate-term momentum that shows the price change relative to 6-month ago.

The investment strategy for momentum investors is to buy winners and sell losers. That is, buy stocks that performed well and sell stocks that performed poorly in the past.


Chipbond Technology 6-Month Price Index Related Terms

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Chipbond Technology Business Description

Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300
Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services.

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