Chipbond Technology (ROCO:6147) Other Financing : NT$-4,058 Mil (TTM As of Mar. 2024)

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What is Chipbond Technology Other Financing?

Chipbond Technology's Other Financing for the three months ended in Mar. 2024 was NT$1 Mil.

Chipbond Technology's Other Financing for the trailing twelve months (TTM) ended in Mar. 2024 was NT$-4,058 Mil.

Chipbond Technology Other Financing Historical Data

The historical data trend for Chipbond Technology's Other Financing can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Chipbond Technology Other Financing Chart

Chipbond Technology Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Other Financing

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0.57

2.28

4.18

Chipbond Technology Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Other Financing	Get a 7-Day Free Trial															1.42	0.72	-4,061.21	0.53	1.49

Chipbond Technology Other Financing Calculation

Other Financing represents other cash flow from financing activity that not otherwise classified, which includes:
Proceeds From Stock Option Exercised
Other Financing Charges

Other Financing for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was NT$-4,058 Mil.

Chipbond Technology Other Financing Related Terms

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Chipbond Technology (ROCO:6147) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Chipbond Technology Corp (ROCO:6147) » Definitions » Other Financing

Comparable Companies

Traded in Other Exchanges

N/A

Address

No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300

Website

http://www.chipbond.com.tw

Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services.

Chipbond Technology (ROCO:6147) Headlines

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