Chipbond Technology (ROCO:6147) Change In Inventory : NT$137 Mil (TTM As of Mar. 2024)

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What is Chipbond Technology Change In Inventory?

Chipbond Technology's change in inventory for the quarter that ended in Mar. 2024 was NT$147 Mil. It means Chipbond Technology's inventory declined by NT$147 Mil from Dec. 2023 to Mar. 2024 .

Chipbond Technology's change in inventory for the fiscal year that ended in Dec. 2023 was NT$68 Mil. It means Chipbond Technology's inventory declined by NT$68 Mil from Dec. 2022 to Dec. 2023 .

Chipbond Technology's Total Inventories for the quarter that ended in Mar. 2024 was NT$1,556 Mil.

Days Inventory indicates the number of days of goods in sales that a company has in the inventory. Chipbond Technology's Days Inventory for the quarter that ended in Mar. 2024 was 41.02.

Inventory Turnover measures how fast the company turns over its inventory within a year. Chipbond Technology's Inventory Turnover for the quarter that ended in Mar. 2024 was 2.22.

Inventory-to-Revenue determines the ability of a company to manage their inventory levels. It measures the percentage of Inventories the company currently has on hand to support the current amount of Revenue. Chipbond Technology's Inventory-to-Revenue for the quarter that ended in Mar. 2024 was 0.38.

Chipbond Technology Change In Inventory Historical Data

The historical data trend for Chipbond Technology's Change In Inventory can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Chipbond Technology Change In Inventory Chart

Chipbond Technology Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Change In Inventory

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-327.26

-242.50

-137.18

-314.51

68.34

Chipbond Technology Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Change In Inventory	Get a 7-Day Free Trial															78.37	-280.25	102.00	168.22	147.15

Chipbond Technology Change In Inventory Calculation

Change In Inventory is the difference between last period's ending inventory and the current period's ending inventory.

Change In Inventory for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was NT$137 Mil.

Chipbond Technology (ROCO:6147) Change In Inventory Explanation

1. Days Inventory indicates the number of days of goods in sales that a company has in the inventory.

Chipbond Technology's Days Inventory for the quarter that ended in is calculated as:

Days Inventory	=	Average Total Inventories	/	Cost of Goods Sold	*	Days in Period
	=	1629.8795	/	3625.585	*	365 / 4
	=	41.02

2. Inventory Turnover measures how fast the company turns over its inventory within a year.

Chipbond Technology's Inventory Turnover for the quarter that ended in Mar. 2024 is calculated as

Inventory Turnover	=	Cost of Goods Sold	/	Average Total Inventories
	=	3625.585	/	1629.8795
	=	2.22

3. Inventory-to-Revenue determines the ability of a company to manage their inventory levels. It measures the percentage of Inventories the company currently has on hand to support the current amount of Revenue.

Chipbond Technology's Inventory to Revenue for the quarter that ended in Mar. 2024 is calculated as

Inventory-to-Revenue	=	Average Total Inventories	/	Revenue
	=	1629.8795	/	4284.371
	=	0.38

Chipbond Technology Change In Inventory Related Terms

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Chipbond Technology (ROCO:6147) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Chipbond Technology Corp (ROCO:6147) » Definitions » Change In Inventory

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Traded in Other Exchanges

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Address

No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300

Website

http://www.chipbond.com.tw

Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services.

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