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Chipbond Technology (ROCO:6147) General and Admin. Expense : NT$1,169 Mil (TTM As of Mar. 2024)


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What is Chipbond Technology General and Admin. Expense?

General and Admin. Expense is the aggregate total of general managing and administering expenses for the company. Chipbond Technology's General and Admin. Expense for the three months ended in Mar. 2024 was NT$334 Mil. Its General and Admin. Expense for the trailing twelve months (TTM) ended in Mar. 2024 was NT$1,169 Mil.


Chipbond Technology General and Admin. Expense Historical Data

The historical data trend for Chipbond Technology's General and Admin. Expense can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Chipbond Technology General and Admin. Expense Chart

Chipbond Technology Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
General and Admin. Expense
Get a 7-Day Free Trial Premium Member Only Premium Member Only 725.53 762.16 1,025.85 1,007.72 1,040.04

Chipbond Technology Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
General and Admin. Expense Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 204.43 273.01 286.14 276.47 333.59

Chipbond Technology General and Admin. Expense Calculation

General and Admin. Expense is the aggregate total of general managing and administering expenses for the company.

General and Admin. Expense for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was NT$1,169 Mil.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


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Chipbond Technology (ROCO:6147) Business Description

Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300
Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services.

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