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Chipbond Technology (ROCO:6147) Purchase Of Investment : NT$0 Mil (TTM As of Mar. 2025)


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What is Chipbond Technology Purchase Of Investment?

Chipbond Technology's purchase of investment for the three months ended in Mar. 2025 was NT$0 Mil. It means Chipbond Technology spent NT$0 Mil on purchasing investments. Chipbond Technology's purchase of investment for the trailing twelve months (TTM) ended in Mar. 2025 was NT$0 Mil.

Compared with last quarter (NT$0 Mil in Dec. 2024 ), Chipbond Technology spent the same money on purchasing investments in Mar. 2025 (NT$0 Mil).


Chipbond Technology Purchase Of Investment Historical Data

The historical data trend for Chipbond Technology's Purchase Of Investment can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Chipbond Technology Purchase Of Investment Chart

Chipbond Technology Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Purchase Of Investment
Get a 7-Day Free Trial Premium Member Only Premium Member Only -3,083.81 -115.00 -100.00 - -10.00

Chipbond Technology Quarterly Data
Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24 Mar25
Purchase Of Investment Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only - - - - -

Chipbond Technology Purchase Of Investment Calculation

Purchase of Investments represents cash outflow on the purchase of investments in securities.

Purchase Of Investment for the trailing twelve months (TTM) ended in Mar. 2025 adds up the quarterly data reported by the company within the most recent 12 months, which was NT$0 Mil.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Chipbond Technology Purchase Of Investment Related Terms

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Chipbond Technology Business Description

Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300094
Chipbond Technology Corp is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services. The products and services offered by the company include, Chip Tray, SiGe Wafer, SiC Wafer, Gold Bumping services, Packaging attachment services among others.

Chipbond Technology Headlines

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