Chipbond Technology (ROCO:6147) Tax Rate % : 16.27% (As of Dec. 2024)

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What is Chipbond Technology Tax Rate %?

Tax Rate % is calculated as Tax Expense divided by its Pre-Tax Income. Chipbond Technology's Tax Expense for the three months ended in Dec. 2024 was NT$180 Mil. Chipbond Technology's Pre-Tax Income for the three months ended in Dec. 2024 was NT$1,105 Mil. Therefore, Chipbond Technology's Tax Rate % for the quarter that ended in Dec. 2024 was 16.27%.

Chipbond Technology Tax Rate % Historical Data

The historical data trend for Chipbond Technology's Tax Rate % can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Chipbond Technology Tax Rate % Chart

Chipbond Technology Annual Data

Trend

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Dec24

Tax Rate %

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17.73

17.38

18.93

16.11

13.18

Chipbond Technology Quarterly Data
	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24	Jun24	Sep24	Dec24
Tax Rate %	Get a 7-Day Free Trial															13.57	6.17	17.46	13.67	16.27

Chipbond Technology Tax Rate % Calculation

Tax Rate % is the ratio of tax expense divided by pretax income, usually presented in percent.

Chipbond Technology's Tax Rate % for the fiscal year that ended in Dec. 2024 is calculated as

Tax Rate %	=	Tax Expense (A: Dec. 2024 )	/	Pre-Tax Income (A: Dec. 2024 )
	=	627.6	/	4762.22
	=	13.18 %

Chipbond Technology's Tax Rate % for the quarter that ended in Dec. 2024 is calculated as

Tax Rate %	=	Tax Expense (Q: Dec. 2024 )	/	Pre-Tax Income (Q: Dec. 2024 )
	=	179.8	/	1105.424
	=	16.27 %

Chipbond Technology Tax Rate % Related Terms

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Chipbond Technology Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Chipbond Technology Corp (ROCO:6147) » Definitions » Tax Rate %

Comparable Companies

Traded in Other Exchanges

N/A

Address

No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300094

Website

https://www.chipbond.com.tw

Chipbond Technology Corp is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services. The products and services offered by the company include, Chip Tray, SiGe Wafer, SiC Wafer, Gold Bumping services, Packaging attachment services among others.

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