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Chipbond Technology (ROCO:6147) Additional Paid-In Capital : NT$3,894 Mil(As of Mar. 2025)


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What is Chipbond Technology Additional Paid-In Capital?


Chipbond Technology's quarterly additional paid-in capital increased from Sep. 2024 (NT$3,834 Mil) to Dec. 2024 (NT$3,864 Mil) and increased from Dec. 2024 (NT$3,864 Mil) to Mar. 2025 (NT$3,894 Mil).

Chipbond Technology's annual additional paid-in capital declined from Dec. 2022 (NT$4,271 Mil) to Dec. 2023 (NT$3,811 Mil) but then increased from Dec. 2023 (NT$3,811 Mil) to Dec. 2024 (NT$3,864 Mil).


Chipbond Technology Additional Paid-In Capital Historical Data

The historical data trend for Chipbond Technology's Additional Paid-In Capital can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Chipbond Technology Additional Paid-In Capital Chart

Chipbond Technology Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Additional Paid-In Capital
Get a 7-Day Free Trial Premium Member Only Premium Member Only 6,726.56 8,313.55 4,271.06 3,811.46 3,863.61

Chipbond Technology Quarterly Data
Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24 Mar25
Additional Paid-In Capital Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 3,812.13 3,801.99 3,833.80 3,863.61 3,894.27

Chipbond Technology Additional Paid-In Capital Calculation

Capital that a company raises in a financing round in excess of the capital's par value. The account represents the excess paid by an investor over the par-value price of a stock issue. Additional paid-in-capital can arise from issuing either preferred or common stock.

Additional Paid-In Capital is calculated as

Additional Paid-In Capital=(Issue Price-Par Value)* Shares Outstanding (Diluted Average)

Chipbond Technology Additional Paid-In Capital Related Terms

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Chipbond Technology Business Description

Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300094
Chipbond Technology Corp is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services. The products and services offered by the company include, Chip Tray, SiGe Wafer, SiC Wafer, Gold Bumping services, Packaging attachment services among others.

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