Chipbond Technology (ROCO:6147) Additional Paid-In Capital : NT$3,812 Mil(As of Mar. 2024)

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What is Chipbond Technology Additional Paid-In Capital?

Chipbond Technology's quarterly additional paid-in capital increased from Sep. 2023 (NT$3,811 Mil) to Dec. 2023 (NT$3,811 Mil) and increased from Dec. 2023 (NT$3,811 Mil) to Mar. 2024 (NT$3,812 Mil).

Chipbond Technology's annual additional paid-in capital declined from Dec. 2021 (NT$8,314 Mil) to Dec. 2022 (NT$4,271 Mil) and declined from Dec. 2022 (NT$4,271 Mil) to Dec. 2023 (NT$3,811 Mil).

Chipbond Technology Additional Paid-In Capital Historical Data

The historical data trend for Chipbond Technology's Additional Paid-In Capital can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Chipbond Technology Additional Paid-In Capital Chart

Chipbond Technology Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Additional Paid-In Capital

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7,201.04

6,726.56

8,313.55

4,271.06

3,811.46

Chipbond Technology Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Additional Paid-In Capital	Get a 7-Day Free Trial															1,690.28	3,465.03	3,811.20	3,811.46	3,812.13

Chipbond Technology Additional Paid-In Capital Calculation

Capital that a company raises in a financing round in excess of the capital's par value. The account represents the excess paid by an investor over the par-value price of a stock issue. Additional paid-in-capital can arise from issuing either preferred or common stock.

Additional Paid-In Capital is calculated as

Additional Paid-In Capital

(Issue Price

Par Value)

Shares Outstanding (Diluted Average)

Chipbond Technology Additional Paid-In Capital Related Terms

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Chipbond Technology (ROCO:6147) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Chipbond Technology Corp (ROCO:6147) » Definitions » Additional Paid-In Capital

Comparable Companies

Traded in Other Exchanges

N/A

Address

No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300

Website

http://www.chipbond.com.tw

Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services.

Chipbond Technology (ROCO:6147) Headlines

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